CSP Substrate Technology: Fundamentals and Applications

CSP substrate is one of the IC packaging technologies that is used in the formation of microelectronic systems. The size of the package is up to 1 and it can be a combination of parts of the number or only the first part. Two times the die size of the actual die with a single-die package which has direct surface mounts ability. It was first developed in the 1990s as a result of large requirements for small as well as efficient packages.